The InterCon cLGA® land grid array socket system was designed to bring conventional connector material construction to a high performance, low cost socket design. [More...]	Full qual report on the industry's only LGA socket system that is qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specs. [More...]	China, Hong Kong, and Taiwan Distribution - Jetronic Corporation, a major distributor of electronic components in China, Hong Kong, and Taiwan, is now the exclusive distributor of InterCon Systems products in those countries. DLP ^TM Socket Products - InterCon Systems is the only Texas Instruments qualified and approved interconnection product for TI DLP^TM devices.
Mechanical Performance - Mechanical performance specifications Product specification Application specification Current rating Force/deflection data Deflection/resistance data  Electrical Performance - High-speed electrical performance specs  Full electrical characterization test report	High-speed, low cost, solderless, low profile solutions. Standard chip-to-board Application specific chip-to-board Board-to-board Flex-to-board

The InterCon cLGA^® socket is a low cost, high volume, high speed, fully qualified chip-to-board, board-to-board, and flex-to-board solution for land grid array applications. The patented¹ product design uses a gold-over-nickel plated beryllium copper spring technology to guarantee long-term connector reliability and ruggedness during handling and use. The cLGA^® socket is the only product qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specifications.

¹ U.S. patent numbers 6,176,707 and 6,217,342. Other patents pending.

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