InterCon cLGA® land grid array socket system was designed to
bring conventional connector material construction to a high performance,
low cost socket design. Gold over nickel plated beryllium copper spring
contacts guarantee industry understood long term connector performance in a
design that also guarantees contact retention and ruggedness during
handling and use.
The patented1 cLGA® product design features
a C shaped beam, which is held in its contact housing by means of a
retention feature molded into each contact cavity. This retention feature
engages the contact gap to hold the contact reliably in the housing.
Positive contact retention allows the socket to be dropped from several
feet to a rigid surface with no loss of contacts or other product damage.
The ramped retention feature in each housing cavity allows the contact to
deflect when mated between upper and lower surfaces. The product is very
low profile, requiring only .048 inches (1,22 mm) between mating surfaces.
Contacts are assembled into contact housings in high speed automatic
assembly equipment, and these housings typically are heat staked to
separately molded frames to create complete socket products.
socket is fully qualified under the EIA-540BOAE and Telcordia GR-1217-CORE
specifications. See the 'EIA/Telcordia
Qualification Report' section of this page for full test
Because of its low profile between mating surfaces, the product operates at
greater than 7 gigahertz frequencies. A full electrical characterization
report is available in the Electrical Performance
section of this page.
The cLGA® product is available in .050" and 1 millimeter
chip-to-board sockets. Current industry standard sizes are
available in 937, 1089, and 1657 positions.
application of cLGA® sockets in chip-to-board mating is achieved
using a lower bolster plate and upper heat sink above the ceramic device.
Standard mounting hardware can be used. The cLGA® socket mates
to gold plated pads on both board and device surfaces.
Standard products can be selectively loaded to create custom contact
arrays. A two piece frame and insert housing design means that custom
frames can be designed and built with low tooling cost and short lead time
for specialized applications. Fully custom application
specific chip-to-board sockets are also available.
Large contact array sockets are achieved by combining multiple housings in
an outer frame for interconnecting high signal count multi chip modules.
Current products approach 4000 contacts per device, with 5000 contacts per
device now in design.
cLGA® technology is also available as cSTACKTM board-to-board
circuit-to-board stacking connectors. In these product applications,
the cSTACKTM connector is a low cost, high signal
integrity, solderless alternative to standard two piece connectors.
The cLGA® product family represents low cost, high signal
integrity, high reliability next generation chip-to-board, flex-to-board, and
board-to-board interconnection technology.
1 U.S. Patent numbers 6,176,707 and 6,217,342. Other patents
© 2008 Amphenol InterCon Systems, Inc.