Qualified to both EIA-540BOAE and Telcordia GR-1217-CORE Conventional connector material construction - gold over nickel plated beryllium copper contacts, high temperature thermoplastic housings Solderless socket termination eliminates thermal stress of soldered socket products, allows field device upgrades Patented contact retention feature for positive contact retention during handling and use Positive housing stop during contact deflection for contact anti-overstress protection and superior shock and vibration performance Custom and standard outer molded frames allow tailored designs for specific applications, or standard frames for cost effective solutions Standard .050" and 1 mm centerline contact grid products available Selectively loaded standard housings allow custom footprints at low tooling cost Low profile design yields superior high-speed electrical performance Standard Socket Products: Part Number Description 1 mm centerline: 7731-001 961 position, 31 x 31 7731-002 937 position, 31 x 31 7730-001 1681 position, 41 x 41 7730-002 1657 position, 41 x 41   .050" centerline: 7729-001 1089 position, 33 x 33 7729-002 544 position, 33 x 33 Copyright © 2005 InterCon Systems, Inc. Contact: Webmaster@interconsystems.com.